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ADSP-BF533Blackfin处理器参数介绍及中文PDF下载

来源:ADI  作者:ADI官网   2020-04-27 阅读:686

ADSP-BF533相关信息来自ADI官网,具体参数以官网公布为准,ADSP-BF533供应信息可在查IC网搜索相关供应商。

产品详情

The ADSP-BF533 provides a high performance, power-effICient processor choice for today's most demanding convergent signal processing applications. The high performance 16-bit/32-bit Blackfin® embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer,communications, automotive, and industrial/instrumentation.

Architectural Features
  • High performance 16-bit/32-bit embedded processor core
  • 10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density
  • Full SIMD architecture, including instructions for accelerated video and image processing
  • Memory management unit (MMU) supporting full memory protection for an isolated and secure environment

High Level of Integration
  • Up to 148 kB of on-chip SRAM
  • Glueless video capture and display port
  • Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels
  • 12 DMA channels supporting one- and two-dimensional data transfers
  • Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
  • 160-ball mini-BGA, 169-ball PBGA packages
  • Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available

优势和特点

  • Application-tuned peripherals provide glueless connectivity to general-purpose converters in data acquisition applications
  • Large on-chip SRAM for maximum system performance

ADSP-BF533电路图

ADSP-BF533

ADSP-BF533中文PDF下载地址

ADSP-BF533下载链接地址:https://www.analog.com/media/en/technical-documentation/data-sheets/ADSP-BF531_BF532_BF533.pdf

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