ADI:Providing an Edge in Capacitive Sensor Applications
A look at the challenges such as of thick molding compounds, noisy environments, reliability concerns, and long interconnect distances from sensor to IC.
2020-04-26 15:17:45A look at the challenges such as of thick molding compounds, noisy environments, reliability concerns, and long interconnect distances from sensor to IC.
2020-04-26 15:17:45